Following requests from c-Si cell manufacturers, module manufacturers, equipment companies, and research institutes, SoltaBond has developed a variety of optimized conductive adhesives. By carefully matching the adhesive properties to different surfaces, these new adhesives are especially suitable for the variety of new cell concepts, such as back contact, heterojunction thin cells, or Cu-galvanic cells, and allow for cost reduction in many ways.

Your Contact

SoltaBond GmbH
Your Product Specialist

Tel. +49 7243 604 4000
info@soltabond.de

Polytec PT GmbH
Order Processing

Tel. +49 7243 604 4000
info@polytec-pt.de